Artaflex Inc. Toronto, ON

174 W Beaver Creek Rd.
Richmond Hill, ON, L4B 1B4

Toll Free: 1.866.502.3378
Office: 905.470.0109
Fax: 905.470.0621
1.866.502.3378 sales@artaflex.com

Artaflex follows the mantra of people, process, and tools to deliver quality product that helps make our customers successful. By employing skilled staff, using state of the art manufacturing technology and adhering to strict quality processes, we have successfully achieved high yields on assemblies containing the latest dense semiconductor packages.

Our engineering staff consults with your design team throughout the design process to pinpoint and provide feedback on elements that can be modified to improve yield and lower manufacturing cost. Our lines achieve industry-leading accuracy, and our quality processes are continuously monitored and incrementally improved, all with the goal of generating product that maximizes the reputation and revenue of our customers.

Globally, Artaflex offers low-to-high volume and low-to-high mix PCBA and system assemblies, including:

  • NPI manufacturing & service solutions
  • State of the art surface mount assembly machines
  • Juki, Universal, MyData
  • Automated SMT Assembly
  • PTH Assembly
  • Automated Selective Soldering
  • IPC Class III MFG Process
  • 0201, microBGA, CCGA, CSP, Ultra fine pitch
  • Test Services (ICT, JTAG, Functional)
  • Electronic Manufacturing & Quality Tracking System
  • Automated Optical Inspection (AOI)
  • Automated Polarity & Value Verification
  • Infrared closed loop rework station
  • Aquatic/Saponifier Wash
  • “Through-hole” and “pressfit” assembly capabilities
  • Sheet Metal Fabrication
  • Chassis Fabrication
  • Both manual & automated assembly equipment and processes
  • Complex manufacturing (experienced up to 60 layers 30+ BGA’s)
  • Low volume / high mix to high speed / high volume placement
  • Automated pre-placement polarity, mechanical and electrical verification

Manufacturing leading edge technologies:

  • 0201 / 01005
  • 0.3 mil BGA
  • Package on Package (POP)
  • Land Grid Array
  • Chip Scale Packaging
  • QFN
  • Pin in Paste
  • Step Printing
  • Mixed lead / lead free assembly
  • Flex / Flex – Rigid Circuit Assembly

 

Additional capabilities include electromechanical assembly, metal fabrication and selective wave soldering.

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