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The Artaflex CAD layout team has many years of experience in complex design of printed circuit boards up to 28 layers. Experience that includes pre and post layout simulation up to 10 GHZ., differential pairs, controlled impedance, High Density Interconnect HDI, Blind and buried vias, DDR3 Memory, PCI Express, HyperTransport, Multi channel gigabit speeds, and more. We understand the PCB manufacturing processes, working with the PCB vendor, whether Asian or North American, when specifying the board stack-up.

PCB Design Expertise:

  • Pre and post layout high speed simulation to 10 GHZ
  • Differential pairs, Controlled Impedance
  • High Density Interconnect HDI, Blind and buried vias
  • DDR3 Memory, PCI Express, HyperTransport
  • Multi gigabit channel speeds
  • Successful layouts to 64 layer + blind and buried vias
  • Design to IPC design standards
  • Specify Stack up and fabrication notes
  • Tools: Allegro, Altium, Ansoft HFSS, Orcad, Pads, Dx Designer, Hyperlinx
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